SN3986 SnBi58 Tin-based Alloy Solder Powder

Catalog No.	SN3986
Compositions	Tin
Appearance	Deep grey or black powder

SnBi58 Tin-based Alloy Solder Powder is mainly used for component assembly on PCB (Printed Circuit Board). Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality SnBi58 Tin-based Alloy Solder Powder.

INQUIRY

Description

Specification

Technical Data Sheet

SnBi58 Tin-based Alloy Solder Powder Description

SnBi58 Tin-based Alloy Solder Powder is mainly used for component assembly on PCB (Printed Circuit Board). SnBi58 Tin-based Alloy Solder Powder consists of 42% Tin and 58% Bismuth. Its melting point is 138℃.

SnBi58 Tin-based Alloy Solder Powder Specifications

Alloy Component

Melting

Point℃

Gravity g/cm³

Conduct heat

M.S.K

Extend

Mpa

Conductivity

Sn42Bi58

138

8.7

16.0

Particle Size

Type	3#	4#	5#	6#	7#
Size	25~45µm	20~38µm	15~25µm	10~18µm	5~15µm

SnBi58 Tin-based Alloy Solder Powder Applications

SnBi58 Tin-based Alloy Solder Powder is mainly used for component assembly on PCB (Printed Circuit Board).

SnBi58 Tin-based Alloy Solder Powder Packaging

Our SnBi58 Tin-based Alloy Solder Powder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.