SN3980 SnAg0.3Cu0.7 Tin-based Alloy Solder Powder

Catalog No.	SN3980
Compositions	Sn/Ag/Cu
Appearance	Gray powder
Particle Size	2-11um

SnAg0.3Cu0.7 Tin-based Alloy Solder Powder is suitable for a variety of welding, such as iron welding, hot air welding, induction welding, hot plate welding. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality SnAg0.3Cu0.7 Tin-based Alloy Solder Powder.

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Elements Specification(%)	Max	Tested result(%Wt)
Sn96.5±1	99.5	99.1
Ag	0.3±0.1	0.27
Al	0.005	0.0002
As	0.030	0.0050
Sb	0.050	0.0148
Bi	Remainder	Remainder
Cu	0.6~0.8	0.7
Fe	0.010	0.0003
In	0.050	0.0019
Ni	0.010	0.0007
Pb	0.050	0.0257
Cd	0.002	0.0002
Au	0.050	0.0010

Melting Point ℃	227
Working Temperature ℃	150-350
Gravity g/cm3	7.58
Rigidity HB	16
Conduct Heat M.S.K	64
Extend Mpa	60-80
Extend rate %	>70
Conductivity %	16.4

Elements Specification(%)	Max	Tested result(%Wt)
Sn96.5±1	99.5	99.1
Ag	0.3±0.1	0.27
Al	0.005	0.0002
As	0.030	0.0050
Sb	0.050	0.0148
Bi	Remainder	Remainder
Cu	0.6~0.8	0.7
Fe	0.010	0.0003
In	0.050	0.0019
Ni	0.010	0.0007
Pb	0.050	0.0257
Cd	0.002	0.0002
Au	0.050	0.0010

Purity	wt%
Sn	99.1
Ag	0.3±0.1
Al	0.005
As	0.03
Sb	0.05
Bi	Remainder
Cu	0.6~0.8
Fe	0.01
In	0.05
Ni	0.01
Pb	0.05
Cd	0.002
Au	0.05

SN3980 SnAg0.3Cu0.7 Tin-based Alloy Solder Powder

SnAg0.3Cu0.7 Tin-based Alloy Solder Powder Description

SnAg0.3Cu0.7 Tin-based Alloy Solder Powder Specifications

SnAg0.3Cu0.7 Tin-based Alloy Solder Powder Applications

SnAg0.3Cu0.7 Tin-based Alloy Solder Powder Packaging

Specification

Technical Data Sheet

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