Description
Tin Zinc (Sn/Zn) Evaporation Materials are crucial components used in physical vapor deposition techniques, characterized by their combination of tin and zinc elements. Renowned for their versatility, these materials exhibit excellent adhesion, corrosion resistance, and electrical conductivity, making them ideal for thin film coatings in electronic, optical, and industrial applications. With tailored composition and consistent deposition behavior, Tin Zinc (Sn/Zn) Evaporation Materials ensure reliable performance and adherence to stringent quality standards. Their wide range of applications includes but is not limited to semiconductor devices, optical coatings, and corrosion-resistant layers in various industrial settings, contributing significantly to advancements in technology and manufacturing processes.
Specification
Materials
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Tin Zinc
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Density
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7.14-7.31 g/cm3
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Melting Point
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232-419℃
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Thermal Conductivity
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66.8-116 W/m·K
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Electrical Conductivity
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1.59-9.17×10^4 S/m
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Purity
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99.9%
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Applications
1. Electronic Device Manufacturing: Used to manufacture metallization and conductive layers for electronic devices such as semiconductor devices, thin film resistors, electronic connectors, and other electronic devices.
2. Optical Thin Films: Can be used to prepare optical coatings for optical components including lenses, optical filters, mirrors, and anti-reflective coatings.
3. Decorative Coatings: In construction and home decoration, Tin Zinc (Sn/Zn) Evaporation Materials can be used to prepare decorative metalized films such as gold, silver, and copper plating.
4. Anti-corrosion coatings: Due to the good corrosion resistance of tin and zinc, these materials can also be used to prepare anti-corrosion coatings to protect metal surfaces from corrosion and oxidation.
Packing
Our Tin Zinc (Sn/Zn) Evaporation Materials are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage caused during storage or transportation.