VD0625 Copper Zinc (Cu/Zn) Evaporation Materials

Description

Copper Zinc (Cu/Zn) Evaporation Materials are essential elements in vacuum deposition processes, consisting of copper and zinc alloys. These materials offer customizable electrical and thermal properties, making them vital in various thin-film applications. Leveraging copper's excellent electrical conductivity and zinc's unique alloying capabilities, Cu/Zn Evaporation Materials find applications in semiconductor devices, metallization coatings, and thermal management systems. Their versatility and tailored properties enable precise control over film deposition, ensuring optimal performance in diverse technological applications. With their reliability and adaptability, Cu/Zn Evaporation Materials continue to drive innovation in thin-film technology, addressing the demands of emerging electronic and energy sectors.

Specification

Applications

1. Semiconductor industry: Metallization layers, connectors, and conductive lines are used in the manufacture of semiconductor devices to improve the performance and stability of the devices.

2. Electronic devices: Used in the manufacture of metalized coatings, connectors, and conductive lines for electronic devices such as circuit boards, touchscreens, and electronic displays.

3. Thermal management systems: Used as thermally conductive materials or heat sinks to help manage heat in electronic devices and optoelectronic devices to improve system efficiency and stability.

4. Optical coatings: Applied to prepare thin films with specific optical properties, such as mirrors, lenses, and optical filters.

5. Metal Coatings: Used as surface coatings to increase the corrosion resistance and mechanical strength of metal parts.

Packing

Our Copper Zinc (Cu/Zn) Evaporation Materials are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage caused during storage or transportation.