SN3988 SnBi30Cu0.5 Tin-based Alloy soldering paste

Catalog No.	SN3988
Compositions	Tin, Bismuth, Copper
Appearance	Dark grey paste

SnBi30Cu0.5 Tin-based Alloy soldering paste has an appropriate melting point and can be used with original lead equipment reflux and small thermal impact on electronic components. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-qualitySnBi30Cu0.5 Tin-based Alloy soldering paste.

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Description

Specification

SnBi30Cu0.5 Tin-based Alloy soldering paste Description

SnBi30Cu0.5 Tin-based Alloy soldering paste has an appropriate melting point and can be used with original lead equipment reflux and small thermal impact on electronic components. It has a small thermal shock to electronic components, low process cost, low solder cost, and good reliability.

SnBi30Cu0.5 Tin-based Alloy soldering paste Specifications

Alloy composition	Melting Point(℃)
Sn69/Bi 30/Cu 0.5	149-186

SnBi30Cu0.5 Tin-based Alloy soldering paste Applications

SnBi30Cu0.5 Tin-based Alloy soldering paste is mainly used in high-frequency head, remote control, telephone, LED lights, and another civilian motherboard welding.

SnBi30Cu0.5 Tin-based Alloy soldering paste Packaging

Our SnBi30Cu0.5Tin-based Alloy soldering paste is carefully handled during storage and transportation to preserve the quality of our product in its original condition.