SN3988 SnBi30Cu0.5 Tin-based Alloy soldering paste
| Catalog No. | SN3988 |
| Compositions | Tin, Bismuth, Copper |
| Appearance | Dark grey paste |
SnBi30Cu0.5 Tin-based Alloy soldering paste has an appropriate melting point and can be used with original lead equipment reflux and small thermal impact on electronic components. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-qualitySnBi30Cu0.5 Tin-based Alloy soldering paste.
Related products: SnCu0.7 Tin-based Alloy Solder Powder, SnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg1.0Cu0.5 Tin-based Alloy Solder Powder, SnAg3.0Cu0.5 Tin-based Alloy Solder Powder
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