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Catalog No. | SN3981 |
Compositions | Sn/Ag/Cu |
Appearance | Gray powder |
Particle Size | 5-45um |
SnAg1.0Cu0.5 Tin-based Alloy Solder Powder features lead-free and environmentally friendly, good welding strength, high-temperature reliability, excellent heat conductivity. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality SnAg1.0Cu0.5 Tin-based Alloy Solder Powder.
Related products: SnCu0.7 Tin-based Alloy Solder Powder, SnAg0.3Cu0.7 Tin-based Alloy Solder Powder, SnAg3.0Cu0.5 Tin-based Alloy Solder Powder, SnSb5 Tin-based Alloy Solder Powder
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