Catalog No. | VD0653 |
Material | Titanium Nickel (Ti/Ni) |
Purity | 99.9% ~ 99.99% |
Shape | Powder/ Granule/ Custom-made |
Titanium Nickel (Ti/Ni) Evaporation Materials provided by Stanford Advanced Materials are alloyed substances utilized in physical vapor deposition processes, characterized by their blend of titanium and nickel elements, suitable for thin film coatings in various electronic, optical, and industrial applications.
Related products:Nickel Titanium (Ni/Ti) Evaporation Materials, Titanium (Ti) Evaporation Materials, Aluminum Titanium (Al/Ti) Evaporation Materials, Chromium Titanium (Cr/Ti) Evaporation Materials, Cobalt Titanium (Co/Ti) Evaporation Materials
Explore the cutting-edge possibilities of thin-film technology with Titanium Nickel (Ti/Ni) Evaporation Materials. This unique alloy seamlessly combines the exceptional properties of titanium and nickel, offering a versatile material for thin-film applications. Engineered for precision and reliability, these evaporation materials redefine the landscape of various technological domains.
Key Features
Synergistic Alloy - Ti/Ni materials leverage the synergies between titanium and nickel, creating an alloy that excels in thin-film performance with combined benefits.
High Melting Points - Benefit from the elevated melting points contributed by titanium (1,668°C) and nickel (1,455°C), ensuring stability and resilience in the thin-film deposition process, even in high-temperature applications.
Exceptional Thermal Stability - The alloy's composition imparts outstanding thermal stability, a critical characteristic for applications exposed to extreme temperatures.
Versatile Applications - Ti/Ni materials find applications across a spectrum of industries, from electronics to aerospace, owing to their adaptable properties.
Property | Value |
---|---|
Composition | Titanium/Nickel (Ti/Ni) |
Purity | 99.9% |
Melting Point | Titanium: 1,668°C, Nickel: 1,455°C |
Density | Titanium: 4.506 g/cm³, Nickel: 8.908 g/cm³ |
Thermal Conductivity | Titanium: 21.9 W/m·K, Nickel: 91.7 W/m·K |
Coefficient of Expansion | Titanium: 8.6 × 10⁻⁶/K, Nickel: 13.3 × 10⁻⁶/K |
Microelectronics - Ti/Ni materials contribute to the manufacturing of advanced microelectronic devices through their application in thin-film technology.
Aerospace Industry - Utilized in aerospace applications, Ti/Ni materials provide reliable thin-film coatings for components exposed to extreme conditions.
Sensor Technology - Ti/Ni materials find applications in sensor technologies where thin films are crucial for the detection and measurement of various parameters.
Our Titanium Nickel (Ti/Ni) Evaporation Materials undergo meticulous packaging to ensure their integrity during transportation and storage. The materials are hermetically sealed in vacuum packaging and further enclosed in protective outer packaging.
High Purity - Meeting the highest purity standards, our Ti/Ni materials ensure the success of thin-film deposition processes.
Customization - Tailor the composition and form of Ti/Ni materials to meet the specific requirements of your thin-film deposition projects, ensuring adaptability for diverse applications.
Technical Excellence - Backed by technical expertise, our Ti/Ni evaporation materials deliver consistent and reliable performance, contributing to the success of your thin-film endeavors.
Embark on the future of thin-film technology with Titanium Nickel (Ti/Ni) Evaporation Materials. For inquiries, customizations, or to place an order, please contact us.
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