Epitaxial Wafer SiC-GaN EPI Description
Epitaxial wafer (EPI) refers to a semiconductor thin film grown on a substrate. The thin film is mainly composed of P-type, quantum well, and N-type. Now the mainstream epitaxial material is gallium nitride (GaN), and the main substrate materials are sapphire, silicon, and silicon carbide.
At present, ordinary epitaxial layers, multilayer structure epitaxial layers, ultra-high resistance epitaxial layers, ultra-thick epitaxial layers can be used on silicon substrates. The resistivity of the epitaxial layer can reach more than one thousand ohms. The conductivity types are P/P++, N/ N++, N/N+, N/N+/N++, N/P/P, P/N/N+, and many other types.
Epitaxial Wafer SiC-GaN EPI Specifications
Wafer Diameter
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4"
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5"
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6"
|
8"
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EPI Layer
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Dopant
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Boron, Phos, Arsenic
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Orientation
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<100>, <111>
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Conductivity type
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P/P++, N/N++, N/N+, N/N+/N++, N/P/P, P/N/N+
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Resistivity
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0.001-50 Ohm-cm
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Res. Uniformity
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Standard <6%, Maximum Capabilities <2%
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Thickness (um)
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0.1-100
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Thickness Uniformity
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Standard <3%, Maximum Capabilities <1%
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Substrate
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Orientation
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<100>, <111>
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Conductivity type/Dopant
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P Type/Boron , N Type/Phos, N Type/As, N Type/Sb
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Thickness (um)
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300-725
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Resistivity
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0.001-100 Ohm-cm
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Surface Condition
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P/P, P/E
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Particle
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<50@.0.5um
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Epitaxial Wafer SiC-GaN EPI Applications
Silicon epitaxial wafers are the core material used to manufacture a wide range of semiconductor devices and are used in industrial, military, and space electronics.
Epitaxial Wafer SiC-GaN EPI Packaging
Our Epitaxial Wafer SiC-GaN EPI is carefully handled during storage and transportation to preserve the quality of our product in its original condition.