CM3433 Oxygen-free Copper Foil/Tape

Catalog No.	CM3433
Material	Oxygen-free Copper
Content	99.95%
Shape	Tape, Foil
Size	Customized

Oxygen-free Copper Tape/Foil has no hydrogen embrittlement, high conductivity, good processing performance, welding performance, corrosion resistance, and low-temperature performance. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Oxygen-free Copper Tape/Foil.

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Description

Specification

Oxygen-free Copper Tape/Foil Description

Oxygen-free copper has no hydrogen embrittlement, high conductivity, good processing performance, welding performance, corrosion resistance, and low-temperature performance. OFC (Oxygen Free Copper): Metallic copper with a purity of 99.995%. Generally used in electrical and electronic applications such as audio equipment, vacuum electronic devices, and cables.

Oxygen-free Copper Tape/Foil Specifications

Chemical Composition (%)
	Copper	Oxygen
Min	99.95	-
Max	-	0.0010

Melting Point – Liquidus °F	1981
Melting Point – Solidus °F	1981
Density lb/cu in. at 68°F	0.323
Specific Gravity	8.94
Electrical Conductivity % IACS at 68°F	101
Thermal Conductivity Btu/ sq ft/ ft hr/ °F at 68°F	226
Coefficient of Thermal Expansion 68-212 10⁻⁶ per °F (68 – 212°F)	9.4
Coefficient of Thermal Expansion 68-392 10⁻⁶ per °F (68 – 392°F)	9.6
Coefficient of Thermal Expansion 68-572 10⁻⁶ per °F (68 – 572°F)	9.8
Specific Heat Capacity Btu/ lb /°F at 68°F	0.092

Oxygen-free Copper Tape/Foil Applications

Used in Printed Circuits.

Oxygen-free Copper Tape/Foil Packaging

Our Oxygen-free Copper Tape/Foil is carefully handled during storage and transportation to preserve the quality of our product in its original condition.