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CM0250 Micro Copper Powder (Cu) (CAS No. 7440-50-8)

Catalog No. CM0250
APS 1000μm
Purity 99.9%
Specific Surface Area 4 m2/g

Micro Copper Powder (Cu) is used as a protective coating on metal compounds, protecting parts and threaded fastenings from corrosion. Stanford Advanced Materials (SAM) offers high-quality Micro Copper Powder (Cu) with competitive pricing.

Related products: Tungsten Copper Composite, Nano Copper Powder (Cu), Nano Copper Oxide (CuO)

 

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