DA6384 Heat Conduction Diamond Plate

Heat Conduction Diamond Plate Description

Heat Conduction Diamond Plates represent a groundbreaking advancement in thermal management materials, uniquely engineered to provide both exceptional thermal conductivity and electrical conductivity. These plates combine the superior heat-dissipating properties of diamond with the ability to conduct electricity, offering low dielectric and resistive losses. This makes them an ideal solution for applications where optimal thermal management is essential while maintaining minimal impact on electrical RF performance. Key applications include high-power RF devices, optoelectronics, and high-voltage semiconductors, where efficient heat dissipation and electrical integrity are critical.

Heat Conduction Diamond Plate Specifications

Heat Conduction Diamond Plate Application

• Third-generation semiconductor high-power devices, high-power lasers, and microelectronic heat sink components.

Heat Conduction Diamond Plate Packing

Our Heat Conduction Diamond Plates are carefully handled during storage and transportation to preserve the quality of our product in its original condition.