Description of Copper Bonding Wire
The Cu bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. The Cu bonding wire has the advantages of low price, good mechanical properties, and high electrical conductivity. SAM can provide Cu bonding wire with different wire diameters from 15um-50um according to customer requirements.
Specifications of Copper Bonding Wire
Diameter
|
Properties
|
EL%
|
BL(CN)
|
um
|
mil
|
CUBW-1
|
CUBW-2
|
CUBW-3
|
CUBW-1
|
CUBW-2
|
CUBW-3
|
15
|
0.6
|
2-8
|
2-8
|
3-6
|
5-13
|
5-13
|
9-15
|
16
|
0.63
|
2-8
|
2-8
|
3-6
|
5-13
|
5-13
|
9-15
|
17
|
0.67
|
2-8
|
2-8
|
4-7
|
5-13
|
5-13
|
10-16
|
18
|
0.7
|
3-9
|
3-9
|
4-7
|
7-15
|
7-15
|
10-16
|
19
|
0.75
|
3-9
|
3-9
|
4-7
|
7-15
|
7-15
|
10-16
|
20
|
0.8
|
4-10
|
4-10
|
5-9
|
8-18
|
7-15
|
10-18
|
23
|
0.9
|
5-11
|
5-11
|
7-11
|
8-18
|
8-16
|
12-19
|
25
|
1.0
|
6-12
|
6-12
|
9-13
|
8-18
|
8-16
|
13-21
|
28
|
1.1
|
8-15
|
8-15
|
11-17
|
10-20
|
8-16
|
14-22
|
30
|
1.2
|
10-18
|
10-18
|
13-20
|
15-21
|
8-16
|
14-23
|
32
|
1.25
|
10-30
|
10-30
|
16-23
|
15-21
|
10-20
|
14-23
|
33
|
1.3
|
10-30
|
10-30
|
16-23
|
15-21
|
10-20
|
14-23
|
35
|
1.4
|
10-30
|
10-30
|
23-30
|
15-21
|
10-20
|
15-25
|
38
|
1.5
|
15-35
|
15-35
|
23-30
|
15-22
|
10-20
|
15-25
|
42
|
1.65
|
22-42
|
22-42
|
25-33
|
15-22
|
10-20
|
15-25
|
44
|
1.73
|
22-42
|
22-42
|
15-25
|
15-22
|
10-20
|
15-25
|
45
|
1.8
|
22-42
|
22-42
|
15-25
|
15-22
|
10-20
|
15-25
|
50
|
2.0
|
30-50
|
30-50
|
40-55
|
15-22
|
10-20
|
15-25
|
Applications of Copper Bonding Wire
- Semiconductor discrete components
- Light-emitting diodes (LEDs)
- Integrated circuits