Boron Nitride Evaporation Materials Description
Boron Nitride (BN) Evaporation Materials are vital components used in thin film deposition processes, particularly in the semiconductor, optics, and aerospace industries. These materials are prized for their exceptional thermal stability, electrical insulation properties, and resistance to high temperatures, making them ideal for various applications.
Boron Nitride Evaporation Materials Specifications
Property |
Value |
Material Type |
Boron Nitride |
Symbol |
BN |
Appearance/Color |
White |
Melting Point |
Approx. 2,973°C (5,383°F) |
Density |
2.1 g/cm³ |
Purity |
99.9% |
Shape |
Powder/Granule/Custom-made |
Boron Nitride Evaporation Materials Typical Applications
- Electronic parts — heat sinks, substrates, coil forms, prototypes
- Boron doping wafers in silicon semiconductor processing
- Vacuum melting crucibles
- CVD crucibles
- Microcircuit packaging
- Sputtering targets
- High-precision sealing, brazing, and metalizing fixtures
- Microwave tubes
- Horizontal caster break rings
- Low friction seals
- Plasma arc insulators
- High-temperature furnace fixtures and supports
- Various types of components for semiconductor manufacturing equipment
- Metal/glass demolding/corrosion-resistant material
- Electronic components assembling jigs
- Electric furnace insulation members
Boron Nitride Evaporation Materials Customization
Stanford Advanced Materials understands the importance of precise specifications for many applications. We offer customization options for Boron Nitride Evaporation Materials, including specific shapes, sizes, and purity levels tailored to your exact requirements.
Boron Nitride Evaporation Materials Packing
Our Boron Nitride Evaporation Materials are carefully packaged to ensure their quality and integrity during transportation and storage. We take great care to prevent any damage that may occur during handling and delivery.