Aluminum Nitride Granulation Powder Description
Aluminum Nitride Granulation Powder exhibits the characteristics of high formability and high fluidity. It is suitable for dry pressing, semi-dry pressing process, and cold isostatic pressing process. Aluminum Ntride is well-known for its excellent thermal and electrical properties, making it a valuable material in electronics, semiconductor manufacturing, and other high-performance applications.
Aluminum Nitride Granulation Powder Specifications
Technical Item
|
Unit
|
SANG-80
|
Purity
|
%
|
≥95
|
Particle Size
|
D10
|
μm
|
-
|
D50
|
80~100
|
D90
|
-
|
Liquidity
|
s/50g
|
87
|
Bulk Density
|
g/cm3
|
0.96
|
Moisture
|
%
|
0.11
|
Aluminum Nitride Granulation Powder Applications
- Electronics and Semiconductors:
Substrates for electronic circuits
Heat sinks for electronic components
Thermal management in semiconductor devices
High-performance ceramics for thermal and electrical insulation
LED substrates and heat dissipation materials
Ceramic substrates for power modules, MOSFETs, and IGBTs
- Military and Aerospace Applications:
Heat-resistant components for electronics and thermal shielding
Temperature sensors and piezoelectric devices
Substrates for lasers and optical components
- Microelectronics Packaging:
Multilayer ceramic substrates for microelectronic circuits
Aluminum Nitride Granulation Powder Packaging
Our Aluminum Nitride Granulation Powder is carefully handled during storage and transportation to preserve the quality of our product in its original condition.