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CU4273 Tin-Plated Copper Foil

Catalog No. CU4273
Size Customized
Thickness 12μm, or customized
Working Temperature 20-120℃
Purity Cu 99.9%

Tin-Plated Copper Foil is suitable for Low frequency EMI Shielding. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Tin-Plated Copper Foil.

Related products: Gold-plated Polyimide Film, Oxygen-free Copper Foil/Tape, Conductive Carbon Coated Copper Foil

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