IN7054 Indium/Silver Alloy Foil (In97/Ag 3)

Indium/Silver Alloy Foil (In97/Ag 3) Description

Indium/Silver Alloy Foil (In97/Ag 3) is engineered to deliver exceptional performance in thermal management and electrical connectivity. Produced with rigorous quality standards, this alloy foil offers superior ductility and adaptability, enabling precision applications. With a melting point of approximately 143°C, it is suitable for soldering processes where low-temperature assembly is critical. Its reliable mechanical properties and excellent thermal conductivity make it highly valuable in advanced electronic manufacturing, high-performance thermal interfaces, and specialized sealing applications.

Indium/Silver Alloy Foil (In97/Ag 3) Applications

Electronics Assembly: Optimal for low-temperature soldering and interconnect solutions in semiconductor packaging.

Thermal Interface Materials: Efficiently dissipates heat in electronic devices such as CPUs, GPUs, and high-power modules.

Sealing Solutions: Provides reliable hermetic seals in cryogenic and vacuum applications due to excellent malleability and sealing performance.

Medical Equipment: Utilized in medical device manufacturing for precision sealing and reliable electrical connections.

Indium/Silver Alloy Foil (In97/Ag 3) Packing

Our Indium/Silver Alloy Foil (In97/Ag 3) is packaged with the utmost care to maintain purity and product integrity.

Standard Vacuum-Sealed Packaging: Customized per client specifications (typically 1kg per roll, customized quantities available).

Frequently Asked Questions

What is Indium/Silver Alloy Foil primarily used for?
It is primarily used for soldering, thermal management solutions, and hermetic sealing in electronics and medical equipment due to its excellent thermal and electrical properties.

Why choose In97/Ag 3 alloy for thermal management applications?
The In97/Ag 3 alloy is chosen for thermal management applications due to its outstanding thermal conductivity, ductility, and low melting temperature, facilitating efficient heat dissipation.

Can the thickness of Indium/Silver Alloy Foil be customized?
Yes, Stanford Advanced Materials provides customized thicknesses to meet specific application requirements.

What makes Indium/Silver Alloy Foil suitable for electronics assembly?
Its low melting point, high electrical conductivity, and ease of forming make it ideal for precise, reliable soldering connections in electronics manufacturing.

Is Indium/Silver Alloy Foil biocompatible?
Yes, Indium alloys generally exhibit good biocompatibility and are suitable for medical and dental applications.