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IN5830 Indium Tin Alloy Foil

Catalog No. IN5830
Material In/Sn
Density 7.3 g/cm3
Shape Foil

Indium Tin Alloy Foil is a solid metallic foil composed of a combination of indium and tin. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Indium Tin Alloy Foil.

Related Products: Copper Indium Alloy Powder (Cu-In), Indium Tin Alloy Rod, Indium Tin Alloy Wire

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Indium Tin Alloy Foil
Indium Tin Alloy Foil
Indium Tin Alloy Foil
Indium Tin Alloy Foil
Description
Specification

Indium Tin Alloy Foil Description

Indium Tin Alloy Foil is a solid metallic foil composed of a combination of indium and tin. This alloy is notable for its unique properties and applications, especially in the electronics and semiconductor industries. The alloy exhibits good resistance to oxidation and corrosion, which enhances its durability in various environments.

Indium Tin Alloy Foil Specifications

Material

In/Sn

Density (g/cm3)

7.3

Shape

Foil

Size (mm)

Thickness: 1-4

Wideness*Length: customized

Physical Properties

Melting Point (℃)

Solid phase/liquid phase

118

Thermal conductivity

(W/m·K)

34

Density

(g/cm3)

7.3

Resistivity

μΩ·m

0.147

Coefficient of thermal expansion

10-6/℃

20

Tensile strength

Mpa

12

Indium Tin Alloy Foil Applications

  • Soldering in Electronics: Ideal for soldering delicate components that could be damaged by higher temperatures.
  • Semiconductor Manufacturing: Used in bonding applications for semiconductor chips and devices.
  • Thermal Management: Applied in thermal interface materials to enhance heat dissipation in electronic assemblies.
  • Optoelectronics: Used in the manufacture of optoelectronic devices such as LEDs and photodetectors.

Indium Tin Alloy Foil Packaging

Our Indium Tin Alloy Foil is carefully handled during storage and transportation to preserve the quality of our Product in its original condition.

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