Description of Copper Nitride Powder
Copper nitride is a covalently bonded metal nitride. Due to its structural characteristics, CuN can be applied to the field of optical information storage and high-speed integrated circuits. CuN is a non-toxic and stable raw material that can replace toxic materials based on tellurium elements as optical recording materials. In HCl, CuN is more easily etched than Cu. Therefore, when a metal wire of Cu is deposited on a silicon wafer, the copper nitride film can be used as a mask layer, which can achieve higher signal speed than the Al metal wire used in integrated circuit processing.
Specifications of Copper Nitride Powder
Synonyms
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Tricopper nitride;Nitrilotricopper(I), etc.
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CAS No.
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1308-80-1
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Molecular formula
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Cu3N
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Molecular weight
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204.64
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Melting point
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300℃
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Density
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5.84 g/cm3
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Crystal shape
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Cubic crystals
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solubility
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Decomposes in H2O
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Applications of Copper Nitride Powder
- Used as a neutron poison in nuclear reactors
- The raw material of Gd compound
- Used as catalyst
- Used as optical recording materials
Packaging of Copper Nitride Powder
- 1 kg/bag
- 25 kg/ drum
All packaging materials are suitable for air, sea and road freight. Great care is taken to avoid any damage which might be caused during storage or transportation.