Gold Bonding Wire Description
The gold bonding wire is a kind of material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. SAM can provide Au bonding wire with different wire diameters from 13um-50um according to customer requirements.
Gold Bonding Wire Specifications
Mechanical properties
|
Dia
|
EL%
|
Properties
|
BL(CN)
|
um
|
mil
|
AUBW02
|
AUBW03/AUBW06
|
AUBWD05/AUBWD07
|
AUBWD01/AUBWD03/AUBWD99/
AUBWD06/AUBW10
|
13
|
0.5
|
2-5
|
/
|
>2.5
|
>2.5
|
>3.0
|
14
|
0.55
|
2-5
|
/
|
>3.0
|
>3.0
|
>3.0
|
15
|
0.6
|
2-5
|
/
|
>3.0
|
>3.5
|
>4.0
|
16
|
0.63
|
2-5
|
>2.5
|
>3.0
|
>3.5
|
>4.0
|
17
|
0.67
|
2-5
|
>2.5
|
>3.0
|
>3.5
|
>4.0
|
18
|
0.7
|
2-5
|
>2.5
|
>3.5
|
>4.0
|
>5.0
|
19
|
0.75
|
2-6
|
>3.0
|
>4.0
|
>4.5
|
>5.5
|
20
|
0.8
|
2-6
|
>4.0
|
>4.5
|
>6.0
|
>6.0
|
21
|
0.83
|
2-6
|
>4.5
|
>5.0
|
>6.0
|
>6.5
|
22
|
0.87
|
2-7
|
>4.5
|
>5.5
|
>6.0
|
>7.0
|
23
|
0.9
|
2-7
|
>5.0
|
>6.0
|
>7.0
|
>8.0
|
24
|
0.94
|
2-7
|
>6.0
|
>6.5
|
>7.5
|
>9.0
|
25
|
1
|
2-8
|
>7.0
|
>8.0
|
>10.0
|
>10.0
|
28
|
1.1
|
2-8
|
>9.0
|
>10.0
|
>12.0
|
>11.0
|
30
|
1.2
|
3-8
|
>11.0
|
>12.0
|
>13.0
|
>15.0
|
32
|
1.25
|
3-8
|
>12.0
|
>13.0
|
>15.0
|
>16.0
|
33
|
1.3
|
3-8
|
>13.0
|
>14.0
|
>16.0
|
>18.0
|
35
|
1.4
|
3-10
|
>15.0
|
>16.0
|
>18.0
|
>22.0
|
38
|
1.5
|
3-10
|
>17.0
|
>18.0
|
>21.0
|
>22.0
|
40
|
1.57
|
3-10
|
>20.0
|
>22.0
|
>24.0
|
>26.0
|
45
|
1.8
|
3-12
|
>24.0
|
>25.0
|
>28.0
|
>30.0
|
50
|
2
|
3-12
|
>30.0
|
>32.0
|
>34.0
|
>36.0
|
60
|
2.4
|
7-14
|
>43.0
|
>45.0
|
>50.0
|
>52.0
|
70
|
2.8
|
7-14
|
>50.0
|
>55.0
|
>60.0
|
>63.0
|
Gold Bonding Wire Applications
- Smartphone and phone
- Wearable electronics
- IVD
- Imaging
- CV therapy
- Orthopedics and spine
- Commercial aircraft
- satellite
- NFC technology
- Power generation