AU2029 Gold Bonding Wire

Catalog No.	AU2029
Material	Pure gold (Au)
Purity	2N-4N
Diameter	13-70μm
Length	100-500m

The Gold Bonding Wire is designed for semiconductor packaging, offering superior electrical and thermal conductivity, mechanical strength, and corrosion resistance. With customizable diameters and lengths, it meets specific requirements for high-performance microelectronics.

INQUIRY

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Description

Specification

Video

Gold Bonding Wire Description

Made from ultra-high purity gold (2N-4N), the Gold Bonding Wire is a key component in semiconductor assembly, providing excellent electrical conductivity for reliable connections. It is highly durable and resistant to corrosion, making it ideal for use in harsh environments. The wire is available in ultra-fine diameters ranging from 13 μm to 70 μm and in lengths from 100 meters to 500 meters. The ability to customize these specifications ensures flexibility for a wide range of applications, from advanced integrated circuits to microelectronic devices. Known for its exceptional mechanical properties and thermal conductivity, this bonding wire ensures stable, efficient, and long-lasting connections in high-performance devices.

Gold Bonding Wire Specifications

Theoretical Physical Properties
Density	19.34 g/cm³
Melting Point	1063℃
Electrical Resistivity @20℃	2.3 μΩ·cm
Electrical Conductivity @20℃	75% (IACS)
Thermal Conductivity @20℃	315 W/(m·K)
Fusing Current (10 mm x 25 μm)	0.52 A

Mechanical Properties

Composition	Diameter		Tensile Strength	Elongation
Composition	mil	μm	gms	%
99.99%Au	0.7	17.5	3-10	2-6
	0.8	20	4-13	2-7
	0.9	22.5	5-16	2-8
	1.0	25	6-20	2-8
	1.3	32.5	10-45	2-10
	1.5	37.5	13-50	2-12
	1.7	42.5	15-60	2-12
	1.8	45	20-70	2-12
	2.0	50	25-85	2-15
	3.0	75	50-180	2-20