Description of Aluminum Bonding Wire
The bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. This product is used as an inner lead for packaging and is one of the essential materials in the manufacturing process of integrated circuits and semiconductor separators. SAM can provide Al bonding wire with different wire diameters from 18um-80um according to customer requirements.
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Specifications of Aluminum Bonding Wire
Diameter |
EL%
|
BL(mN)
|
Length(m)
|
um |
mil |
18 |
0.7 |
0.5-4.5 |
66-71 |
25/50/100/300/500
|
20 |
0.8 |
0.5-4.5 |
78-98 |
25 |
1 |
0.5-4.5 |
127-147 |
30 |
1.2 |
0.5-4.5 |
167-186 |
32 |
1.25 |
0.5-4.5 |
186-206 |
33 |
1.3 |
0.5-4.5 |
186-206 |
35 |
1.4 |
0.5-4.5 |
255-184 |
38 |
1.5 |
0.5-4.5 |
304-333 |
45 |
1.8 |
0.5-4.5 |
390-440 |
50 |
2 |
0.5-6.0 |
461-520 |
75 |
3 |
0.5-6.0 |
1090-1325 |
80 |
3.2 |
0.5-6.0 |
1275-1471 |
Applications of Aluminum Bonding Wire
- Smartphone and phone
- Wearable electronics
- IVD
- Imaging
- CV therapy
- Orthopedics and spine
- Commercial aircraft
- Satellite
- NFC technology
- Power generation