AG2027 Silver Bonding Wire
| Catalog No. | AG2027 |
| Material | Pure Silver (Ag) |
| Purity | 2N-4N |
| Diameter | 15-50μm |
| Length | 300-500m |
Stanford Advanced Materials (SAM) distinguishes itself as a premier supplier of silver bonding wires, adeptly tailoring the diameters of metallic bonding wires to accommodate the bespoke requirements of our esteemed clientele.
Other related products: Copper Bonding Wire, Gold Bonding Wire, Aluminum Bonding Wire, Silver Alloy Bonding Wire.
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Description
Specification
Silver Bonding Wire Description
Silver bonding wire constitutes an essential material for semiconductor packaging, endowed with exceptional electrical and thermal conductivity, mechanical resilience, and chemical stability. In comparison to gold, silver (Ag) bonding wire exhibits comparable attributes while offering a more economical alternative. Stanford Advanced Materials (SAM) is equipped to supply Ag bonding wires with diameters ranging from 15 μm to 30 μm, meticulously tailored to meet the specific requirements of our esteemed clients.
Silver Bonding Wire Specifications
|
Diameter |
EL% |
BL(mN) |
Length(m) |
|
|
um |
mil |
|||
|
15 |
0.6 |
1.0-8.0 |
27-55 |
300/500 |
|
18 |
0.7 |
1.0-8.0 |
40-78 |
300/500 |
|
20 |
0.8 |
1.0-8.0 |
50-98 |
300/500 |
|
25 |
1 |
1.0-8.0 |
78-151 |
300/500 |
|
30 |
1.2 |
1.0-10.0 |
109-215 |
300/500 |
Silver Bonding Wire Applications
Silver bonding wire is integral to a multitude of sophisticated applications, including:
- Discrete components in semiconductor devices
- Light-emitting diodes (LEDs)
- Integrated circuits
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