AG2026 Silver Alloy Bonding Wire

Catalog No.	AG2026
Material	Silver alloy(Ag)
Purity	2N-4N
Diameter	15-50μm
Length	300-500m

Stanford Advanced Materials (SAM) is a leading supplier of metallic bonding wires. We can control the diameter metallic bonding wires depending on the customers’ requests.

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Description

Specification

Description of Silver Alloy Bonding Wire

The bonding wire is material for semiconductor packaging which has excellent electrical conductivity, thermal conductivity, mechanical properties, and chemical stability. SAM can provide Ag bonding wire with different wire diameters from 15um-30um according to customer requirements.

Features of silver alloy bonding wire

- Better physical properties than Au bonding wire
- Easier to store than copper
- No gas protection request, reducing production costs
- Lower purchase cost than that of Au wire
- Does not oxidize in clean air

Ag alloy

Specifications of Silver Alloy Bonding Wire

Diameter		Properties
Diameter		EL%			BL（CN）
um	mil	AABW-1	AABW-2	AABW-3	AABW-1	AABW-2	AABW-3
15	0.6	2-8	2-8	2-8	>2.5	>2.5	>3
16	0.63	2-8	2-8	2-8	>2.5	>2.5	>3
17	0.67	2-8	2-8	2-8	>2.5	>3	>4
18	0.7	2-8	2-8	2-8	>2.5	>3	>4
19	0.75	2-8	2-8	2-8	>2.5	>3	>5
20	0.8	2-10	2-8	2-8	>4	>4	>6
23	0.9	2-12	2-8	2-8	>5	>6	>8
25	1.0	2-12	2-8	2-8	>7	>8	>10
27	1.06	2-12	2-8	2-8	>8	>9	>12
28	1.1	2-12	2-8	2-8	>8	>9	>12
30	1.2	2-14	2-10	2-10	>11	>12	>14
33	1.3	2-14	2-10	2-10	>12	>13	>15
35	1.4	2-14	2-10	2-10	>12	>13	>15
37	1.45	2-14	2-10	2-10	>15	>16	>17
38	1.5	2-16	2-12	2-10	>17	>18	>20
40	1.6	2-16	2-12	2-10	>18	>20	>20
42	1.65	2-16	2-12	2-10	>18	>20	>25
45	1.8	2-16	2-12	2-10	>18	>20	>25
50	2.0	3-18	3-10	3-10	>20	>25	>30