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CU4544 Silver Copper Alloy Nanopowder (AgCu)

Catalog No. CU4544
Compositions Ag, Cu
APS 20nm, 50nm, 80-100nm, etc.
Purity 99.99%

Silver Copper Alloy Nanopowder (AgCu) is a lead-free solder material for electrical interconnects and surface-mount technology assembly. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Silver Copper Alloy Nanopowder (AgCu).

Related products: Copper Alloy CuNi2SiCr Powder, Copper Alloy CuAlNiFe Powder, Silver Tin Alloy Nanopowder (AgSn)

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