CB4331 Resin Bond Diamond Cutting Off Wheel

Catalog No.	CB4331
Material	Diamond + Resin
OD	50 - 200 mm
Thickness	0.1 - 2.0 mm
Grit Size	200 - 5000 #

Resin Bond Diamond Cutting Off Wheel efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Resin Bond Diamond Cutting Off Wheel.

INQUIRY

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Description

Specification

Resin Bond Diamond Cutting Off Wheel Description

Resin Bond Diamond Cutting Off Wheel with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials. It has good surface finish.

Resin Bond Diamond Cutting Off Wheel Specification

OD	50 - 200 mm
Grit Size	200 - 5000 #
Thickness	0.1 - 2.0 mm (Based on diamond grit size)

Resin Bond Diamond Cutting Off Wheel Application

It is suitable for hard and brittle materials, such as Ceramics, Optical Glass, Quartz Tubing Rods, Splitter, IR Filter, QFN, Carbide, Ultra Hard Steels, and Metals. Resin Bond is the softest of all the bonds, used in applications that require a smooth surface finish.

Resin Bond Diamond Cutting Off Wheel Packaging

Our Resin Bond Diamond Cutting Off Wheel is carefully handled during storage and transportation to preserve the quality of our product in its original condition.