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  • CB4331 Resin Bond Diamond Cutting Off Wheel

    • CB4331 Resin Bond Diamond Cutting Off Wheel

    Catalog No. CB4331
    Material Diamond + Resin
    OD 50 - 200 mm
    Thickness 0.1 - 2.0 mm
    Grit Size 200 - 5000 #

    Resin Bond Diamond Cutting Off Wheel efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Resin Bond Diamond Cutting Off Wheel.

    Related products: Resin Bond Diamond Grinding Wheel, Resin Bond CBN Grinding Wheel for Steel, Resin Bond Diamond Grinding Wheel (Cup Shape)

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