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NN1568 Nano Tin Copper Alloy Powder

Catalog No. NN1568
Purity >99.8%
APS 80 nm
Specific Surface Area(m2/g) 7.39
Color Black
MSDS/SDS

Nano Tin Copper Alloy Powder is a high-conductivity and mechanically superior powdered alloy, extensively used in electronics, energy, and materials science. According to user requirements of nano particles, Stanford Advanced Materials can provide different sizes of Nano Tin Bismuth Alloy Powder.

Related products: Nano Nickel Powder (Ni)Micro Molybdenum Powder (Mo)Micro Iron Powder (Fe), Nano Copper Powder (Cu)

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Description
Specification
Technical Data Sheet

Nano Tin Copper Alloy Powder Description

Nano Tin Copper Alloy Powder exhibits a unique set of properties due to the combined effects of the constituent metals and the nanoscale dimensions. The particle size typically ranges from 1 to 100 nanometers, resulting in a high specific surface area. This high surface area enhances the material's reactivity and surface-related properties. The alloy demonstrates excellent oxidation and corrosion resistance, which is essential for maintaining stability and performance in various environments. Mechanically, the Nano Tin Copper Alloy Powder has increased strength and hardness due to fine grain size and solid solution strengthening, while also maintaining good ductility. Electrically, it maintains high conductivity, making it suitable for electronic applications, and exhibits excellent solderability, which is crucial for electronic packaging. Thermal properties include good thermal conductivity and high thermal stability, ensuring effective heat dissipation and reliable performance in high-temperature conditions.

Nano Tin Copper Alloy Powder Specification

Materials

Tin Copper

Purity

>99.8%

APS

80 nm

Specific Surface Area(m2/g)

7.39

Color

Black

Nano Tin Copper Alloy Powder Applications

The unique properties of Nano Tin Copper Alloy Powder open up a variety of advanced applications. In the electronics industry, it is extensively used in soldering and conductive pastes due to its high electrical conductivity and excellent solderability, ensuring reliable connections in electronic circuits. It is also a valuable material in additive manufacturing and 3D printing, providing high precision and material efficiency for producing complex components. In coatings, the powder is applied to enhance the wear and corrosion resistance of surfaces, extending the lifespan of the coated materials. Additionally, Nano Tin Copper Alloy Powder serves as an effective catalyst in certain chemical reactions, leveraging its high surface area and reactivity to improve process efficiency. These applications underscore the material's versatility and importance in modern technology and industrial processes.

Nano Tin Copper Alloy Powder Storage Conditions

This product should be stored in dry, cool, and sealing of the environment, can not be exposure to air, in addition, should avoid the heavy pressure, according to ordinary goods transportation.

Nano Tin Copper Alloy Powder Packing

Our Nano Tin Copper Alloy Powder is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.

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