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Catalog No. | SV3684 |
Material | FAg |
Density | 10.47 (g/cm3) |
Resistivity | 1.80 (μΩ·cm) |
Hardness | 80~100(HV 0.3) |
Tensile Strength | 320~400(MPa) |
Elongation after Breaking % | 2 |
Low Voltage Contact (FAg) is achieved by adding a trace of nickel to pure silver to inhibit the growth of silver crystal grains and obtain a fine-grained structure. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality Low Voltage Contact (FAg).
Related products: Low Voltage Contact (AgNiC), Low Voltage Contact (FAg), Low Voltage Contact (AgSnO2/AgSnO2In2O3), High Voltage Contact (CuW/CuCr0.7)
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