Epoxy Molding Compounds (EM-200) Description
Epoxy Molding Compounds are plastic with a high tracking resistance index, good arc resistance, excellent electrical performance, high notch impact, flame retardant, good heat resistance, abrasion resistance, and low water absorption. The room temperature storage period is more than one year.
Epoxy Molding Compounds (EM-200) Specifications
Performance
|
Epoxy Molding Compounds (EM-200)
|
Density
|
1.9~2.1 g/cm3
|
Water absorption (1d / 23℃)
|
≤ 20 mg
|
Mold shrinkage
|
0.4~0.8 %
|
Bending strength
|
≥ 60 MPa
|
Surface resistivity
|
≥ 1.0 × 1012 Ω
|
Volume resistivity
|
≥ 1.0 × 1010 Ω·m
|
Electric strength
|
≥ 12.0 MV/m
|
Comparative tracking index
|
≥ 600 V
|
Arc resistance
|
≥ 180 s
|
Thermal deformation temperature under load
|
≥ 200 ℃
|
Flammability (model thickness 3.2 mm)
|
FV-0 (UL94)
|
Color
|
Black
|
Product form
|
Cylinder
|
Reference molding process conditions:
Injection Molding
|
Mold temperature (℃)
|
Barrel temperature
(℃)
|
Injection pressure
(MPa)
|
Curing time
(s/mm)
|
Dynamic model
|
Fixed mold
|
Anterior segment
|
Back section
|
Epoxy Molding Compounds (EM-200)
|
165 ~ 175
|
165 ~ 175
|
80 ~ 90
|
50 ~ 70
|
60 ~ 100
|
25 ~ 40
|
Compression Molding
|
Mold temperature
(℃)
|
Forming pressure
(MPa)
|
Curing time
(s/mm)
|
Epoxy Molding Compounds (EM-200)
|
165 ~ 175
|
15 ~ 20
|
40 ~ 60
|
Epoxy Molding Compounds (EM-200) Applications
Epoxy Molding Compounds (EM-200) is one of the most common and important packaging materials for modern semiconductor packaging.
Epoxy Molding Compounds (EM-200) Packaging
Our Epoxy Molding Compounds (EM-200) are carefully handled during storage and transportation to preserve the quality of our product in its original condition.