AL3258 Electrostatic Chuck (Al2O3, AlN, Sapphire)
| Catalog No. | AL3258 |
| Material | Al2O3, AlN, Sapphire |
| Size | Designed for φ200/300mm Equipment |
| Purity | ≥99.9% |
Electrostatic Chuck features high purity, high plasma durability, good chucking/de-chucking response, and high-temperature and low-temperature application. Stanford Advanced Materials (SAM) has rich experience in manufacturing and supplying high-quality alumina products.
Related products: Aluminum Oxide Sapphire Crystal Substrate, Sapphire windows, Sapphire Wafer, Aluminum Nitride Custom Machined Parts
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Description
Specification
Electrostatic Chuck Description
A built-in electrode is embedded, using the electrostatic force generated between the structure and the silicon wafer placed on the surface of the ESC. In the semiconductor manufacturing process, this type of product can be used for silicon wafer installation, flatness correction, and silicon wafer cooling.
Electrostatic Chuck Specifications
- Designed for φ200/300mm Equipment
- High-purity Al2O3/AlN/Sapphire material
- High plasma durability
- Good chucking/de-chucking response
- Withstand the extreme natural condition of some samples in both high and low temperature
|
Material |
Sapphire |
|
Color |
Transparent |
|
Content (%) |
99.99 |
|
Density (g/cm3) |
3.97 |
|
Vickers Hardness HV9.807N (Gpa) |
22.5 |
|
Young's Modulus (Gpa) |
470 |
|
Compressive Strength (Mpa) |
2,940 |
|
Thermal Conductivity (20℃) (W/(m·K) |
41 |
Electrostatic Chuck Applications
Electrostatic Chuck is used for silicon wafer installation, flatness correction, and silicon wafer cooling.
Electrostatic Chuck Packaging
Our Electrostatic Chuck is carefully handled during storage and transportation to preserve the quality of our product in its original condition.
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